| 000 | 00567nam a22001697a 4500 | ||
|---|---|---|---|
| 003 | inkolt | ||
| 005 | 20241017151819.0 | ||
| 008 | 241017s2024 ii ||||| |||| 00| 0 eng d | ||
| 082 |
_a621.38 _bKUM |
||
| 100 |
_aKumar, Ajay _98138 |
||
| 245 |
_aSignal integrity assessment of through package multibit vias in glass interposers for 3D integration / _cAjay Kumar |
||
| 260 |
_aHamirpur : _bNational Institute of Technology, _c2024 |
||
| 300 | _axxvi, 128p. | ||
| 502 |
_bDoctor of Philosophy _cEC-NITH _d2024 |
||
| 720 |
_aDhiman, Rohit _eGuide / Supervisor |
||
| 942 |
_cTD _n0 _w6 _xRajesh Pal Patial _y6 _z Rajesh Pal Patial |
||
| 999 |
_c6218 _d6218 |
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