Kumar, Ajay <br/><br/>
Signal integrity assessment of through package multibit vias in glass interposers for 3D integration / 
Ajay Kumar 
 - Hamirpur :  National Institute of Technology,  2024 
 - xxvi, 128p. 
<br/><br/>
<br/><br/><label>Dewey Class. No.: </label>621.38  / KUM