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Signal integrity assessment of through package multibit vias in glass interposers for 3D integration / Ajay Kumar

By: Kumar, Ajay

Material type: Text

TextPublisher: Hamirpur : National Institute of Technology, 2024Description: xxvi, 128pDDC classification: 621.38 Dissertation note: Doctor of Philosophy, Department of Electronics and Communication Engineering, National Institute of Technology Hamirpur, Himachal Pradesh, India - 177005. 2024 Guide / Supervisor: Dhiman, Rohit

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Item type	Current location	Call number	Status	Date due	Barcode
Thesis or Dissertation	Central Library On Display	621.38 KUM (Browse shelf)	Available		TH-2586

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Doctor of Philosophy, Department of Electronics and Communication Engineering, National Institute of Technology Hamirpur, Himachal Pradesh, India - 177005. 2024

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Signal integrity assessment of through package multibit vias in glass interposers for 3D integration / Ajay Kumar

By: Kumar, Ajay

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