Signal integrity assessment of through package multibit vias in glass interposers for 3D integration / Ajay Kumar
By: Kumar, Ajay
Material type:
TextPublisher: Hamirpur : National Institute of Technology, 2024Description: xxvi, 128pDDC classification: 621.38 Dissertation note: Doctor of Philosophy, Department of Electronics and Communication Engineering, National Institute of Technology Hamirpur, Himachal Pradesh, India - 177005. 2024 Guide / Supervisor: Dhiman, Rohit
| Item type | Current location | Call number | Status | Date due | Barcode |
|---|---|---|---|---|---|
Thesis or Dissertation
|
Central Library On Display | 621.38 KUM (Browse shelf) | Available | TH-2586 |
Doctor of Philosophy, Department of Electronics and Communication Engineering, National Institute of Technology Hamirpur, Himachal Pradesh, India - 177005. 2024
There are no comments on this title.